发明名称 CURABLE RESIN COMPOSITION AND PRIMER COMPOSITION
摘要 [Problem] Polyphenylenesulfide (PPS), polypropylene (PP), polyethylene (PE), stainless steel (SUS) and the like correspond to hard-to-bond materials, and thus it has been difficult to improve the adhesion to these materials in adhesives and sealants.;[Solution] Provided is a curable resin composition containing: component (A), being a thermosetting resin composition; andcomponent (B), being an adhesion-imparting agent consisting of a compound represented by the following general formula 1, or, containing the compound represented by the following general formula 1 and a compound represented by the following general formula 2:;wherein in the general formula 1, n represents 0 to 2, R each independently represents an alkyl group having 1 to 10 carbon numbers or a derivative of the alkyl group, R′ represents methyl group, ethyl group or propyl group, and in the general formula 2, m represents 1 to 3, and R1 represents hydrogen atom or methyl group.
申请公布号 US2015136322(A1) 申请公布日期 2015.05.21
申请号 US201314401451 申请日期 2013.05.15
申请人 THREE BOND FINE CHEMICAL CO., LTD. 发明人 Soga Tetsunori
分类号 C09D5/00;B29C65/48;C09J123/26 主分类号 C09D5/00
代理机构 代理人
主权项 1. A curable resin composition comprising: component (A), being a thermosetting resin composition; and component (B), being an adhesion-imparting agent consisting of a compound represented by the following general formula 1, or, an adhesion-imparting agent comprising the compound represented by the following general formula 1 and a compound represented by the following general formula 2: wherein in the general formula 1, n represents 0 to 2, R each independently represents an alkyl group having 1 to 10 carbon numbers or a derivative of the alkyl group, R′ represents methyl group, ethyl group or propyl group, and in the general formula 2, m represents 1 to 3, and R1 represents hydrogen atom or methyl group.
地址 Kanagawa JP