| 摘要 |
This production method for an electronic component uses an outer covering material that comprises a silicone resin, and includes: a step in which an element is dipped into an outer covering material comprising aluminum hydroxide or magnesium hydroxide that is added thereto in a controlled manner so as to be equal to or greater than 60 wt% and less than 70 wt% and a silicone resin to which a non-polar solvent has been added; a step in which the outer covering material that has formed on the surface of the element is dried, the non-polar solvent is evaporated, and the silicone resin composition is exposed on the surface of the outer covering material; and a curing step in which the outer covering material is cured. As a result, it is possible to reduce the amount of silicone resin while maintaining the incombustibility and the withstand voltage of the outer covering material. |
