无铅锡银合金镀层之组合物,申请号TW101145195-传众专利搜索

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发明名称	无铅锡银合金镀层之组合物
摘要
申请公布号	TWI485027	申请公布日期	2015.05.21
申请号	TW101145195	申请日期	2012.11.30
申请人	华荣电线电缆股份有限公司	发明人	周达隆;吕仁中;黄翊婷
分类号	B23K35/26	主分类号	B23K35/26
代理机构		代理人	苏显读台南市安平区庆平路191号4楼之2
主权项	一种无铅锡银合金镀层之组合物，包括有：16至40重量百分比的锌；0.1至1重量百分比的银；0.01至0.3重量百分比的铝；0.001至0.01重量百分比的磷；0.001至0.5重量百分比的锗；以及余量的锡。
地址	高雄市前金区中正四路170号

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