发明名称 |
ELECTRONIC DEVICE INCORPORATING A RANDOMIZED INTERCONNECTION LAYER |
摘要 |
An electronic device incorporating a randomized interconnection layer. In one example, the device includes a randomized interconnection layer having a randomized conductive pattern formed by etching of a heterogeneous layer; and a sensing circuit, electrically coupled to the randomized interconnection layer to detect the randomized conductive pattern. In another example, a method of fabricating the device includes forming a set of electrodes proximate to a silicon substrate; depositing a heterogeneous layer of elements onto the substrate; etching the heterogeneous layer to form a randomized conductive pattern; and electrically coupling the electrodes to a sensing circuit and the randomized conductive pattern. |
申请公布号 |
US2015137380(A1) |
申请公布日期 |
2015.05.21 |
申请号 |
US201314086601 |
申请日期 |
2013.11.21 |
申请人 |
NXP B.V. |
发明人 |
in 't Zandt Michael Antoine Armand;Nguyen Viet Hoang |
分类号 |
H01L23/00;H01L21/768;H01L23/535 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
1. An electronic device, comprising:
a randomized interconnection layer having a randomized conductive pattern formed by etching of a heterogeneous layer; and a sensing circuit, electrically coupled to the randomized interconnection layer to detect the randomized conductive pattern. |
地址 |
Eindhoven NL |