发明名称 ELECTRONIC DEVICE INCORPORATING A RANDOMIZED INTERCONNECTION LAYER
摘要 An electronic device incorporating a randomized interconnection layer. In one example, the device includes a randomized interconnection layer having a randomized conductive pattern formed by etching of a heterogeneous layer; and a sensing circuit, electrically coupled to the randomized interconnection layer to detect the randomized conductive pattern. In another example, a method of fabricating the device includes forming a set of electrodes proximate to a silicon substrate; depositing a heterogeneous layer of elements onto the substrate; etching the heterogeneous layer to form a randomized conductive pattern; and electrically coupling the electrodes to a sensing circuit and the randomized conductive pattern.
申请公布号 US2015137380(A1) 申请公布日期 2015.05.21
申请号 US201314086601 申请日期 2013.11.21
申请人 NXP B.V. 发明人 in 't Zandt Michael Antoine Armand;Nguyen Viet Hoang
分类号 H01L23/00;H01L21/768;H01L23/535 主分类号 H01L23/00
代理机构 代理人
主权项 1. An electronic device, comprising: a randomized interconnection layer having a randomized conductive pattern formed by etching of a heterogeneous layer; and a sensing circuit, electrically coupled to the randomized interconnection layer to detect the randomized conductive pattern.
地址 Eindhoven NL