SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

A semiconductor device includes a first substrate including a surface, and a pad array on the surface of the substrate, wherein the pad array comprises a first type pad and a second type pad located on a same level. The semiconductor device further includes a conductive bump connecting either the first type pad or the second type pad to a second substrate and a via connected a conductive feature at a different level to the first type pad and the via located within a projection area of the first type pad and directly contacting the first type pad. The semiconductor device also has a dielectric in the substrate and directly contacting the second type pad, wherein the second type pad is floated on the dielectric.

主权项

1. A semiconductor device, comprising:
a substrate including a surface; and a plurality of pads disposing on the surface of the substrate, wherein the plurality of pads includes a first type pad and a second type pad, the first type pad is contacting a via located underlying the first type pad and within a projection area of the first type pad, and the second type pad is contacting an underlying isolation within a projection area of the second type pad.