| 发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
| 摘要 |
A semiconductor device includes a die, a conductive post disposed adjacent to the die, and a molding surrounding the conductive post and the die, the molding includes a protruded portion protruded from a sidewall of the conductive post and disposed on a top surface of the conductive post. Further, a method of manufacturing a semiconductor device includes disposing a die, disposing a conductive post adjacent to the die, disposing a molding over the conductive post and the die, removing some portions of the molding from a top of the molding, and forming a recess of the molding above a top surface of the conductive post. |
| 申请公布号 |
US2015137351(A1) |
申请公布日期 |
2015.05.21 |
| 申请号 |
US201314082977 |
申请日期 |
2013.11.18 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
发明人 |
CHENG LI-HUI;TSAI PO-HAO;HUNG JUI-PIN |
| 分类号 |
H01L23/00;H01L23/31;H01L23/482;H01L21/56 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device, comprising:
a die; a conductive post disposed adjacent to the die; and a molding surrounding the conductive post and the die,wherein the molding includes a protruded portion protruded from a sidewall of the conductive post and disposed on a top surface of the conductive post. |
| 地址 |
HSINCHU TW |
