发明名称 DRAM MIM Capacitor Using Non-Noble Electrodes
摘要 A method for forming a capacitor stack includes forming a first bottom electrode layer including a conductive metal nitride material. A second bottom electrode layer is formed above the first bottom electrode layer. The second bottom electrode layer includes a conductive metal oxide material, wherein the crystal structure of the conductive metal oxide material promotes a desired high-k crystal phase of a subsequently deposited dielectric layer. A dielectric layer is formed above the second bottom electrode layer. Optionally, an oxygen-rich metal oxide layer is formed above the dielectric layer. Optionally, a third top electrode layer is formed above the oxygen-rich metal oxide layer. The third top electrode layer includes a conductive metal oxide material. A fourth top electrode layer is formed above the third top electrode layer. The fourth top electrode layer includes a conductive metal nitride material.
申请公布号 US2015137315(A1) 申请公布日期 2015.05.21
申请号 US201514599843 申请日期 2015.01.19
申请人 Intermolecular, Inc. ;Elpida Memory, Inc. 发明人 Chen Hanhong;Chi David;Hashim Imran;Horikawa Mitsuhiro;Malhotra Sandra G.
分类号 H01L49/02;H01L27/108 主分类号 H01L49/02
代理机构 代理人
主权项 1. A semiconductor stack comprising: a first bottom electrode layer disposed over a surface of a substrate, wherein the first bottom electrode layer comprises a conductive metal nitride material; a second bottom electrode layer disposed over the first bottom electrode layer, wherein the second bottom electrode layer comprises a conductive metal oxide material; a dielectric layer disposed over the second bottom electrode layer; and a top electrode layer disposed over the dielectric layer, wherein the top electrode layer comprises a conductive metal nitride material.
地址 San Jose CA US