SILICONE ADHESIVE

摘要

This silicone adhesive is used for bonding semiconductor elements, and comprises: (A) an addition-reaction-curable silicone resin composition having a viscosity at 25°C of less than or equal to 100 Pa·s; (B) a thermally conductive filler having an average particle diameter of greater than or equal to 0.1 µm and less than 1 µm; and (C) a solvent having a boiling point of higher than or equal to 250°C and lower than 350°C. The blending amount of the component (B) is from 100 to 500 parts by mass per 100 parts by mass of the component (A). The blending amount of the component (C) is from 5 to 20 parts by mass per 100 parts by mass of the component (A). The viscosity at 25°C of the silicone adhesive before being cured is from 5 to 100 Pa·s. Thus, it is possible to provide a silicone adhesive that has excellent workability in a transferring process onto a substrate, has high adhesive strength, has excellent durability, and provides a cured product capable of effectively dissipating heat generated from a chip.