| 摘要 |
PROBLEM TO BE SOLVED: To provide a composite board which prevents warpage from occurring on a printed wiring board during reflow for mounting electronic components.SOLUTION: A composite board 100 includes: multiple printed wiring boards 10; and a metal frame 30G including an opening 30 for housing the printed wiring boards 10. The respective printed wiring boards 10 are fixed to the opening 30 being connected with each other through an adhesive 40. Thus, the efficiency of a joint process of joining the respective printed wiring boards 10 to the metal frame 30G is improved. |
