| 发明名称 |
METHOD FOR SHAPING A LAMINATE SUBSTRATE |
| 摘要 |
A method including providing a laminate substrate, characterizing the laminate substrate for warpage characteristics, determining a horizontal plane distortion based on the warpage characteristics, and placing the laminate substrate into a fixture with an adjustment to correct the horizontal plane distortion, the adjustment being located in a center of the laminate substrate, wherein the adjustment contacts the laminate substrate. The method may further include fluxing the laminate substrate, placing a chip onto the laminate substrate, and placing the fixture into a reflow furnace to join the chip and the laminate substrate. |
| 申请公布号 |
US2015136838(A1) |
申请公布日期 |
2015.05.21 |
| 申请号 |
US201514598258 |
申请日期 |
2015.01.16 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Blackshear Edmund;Lombardi Thomas E.;Merte Donald A.;Ostrander Steven P.;Weiss Thomas;Zheng Jiantao |
| 分类号 |
H01L23/00;H01L21/66 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method comprising:
providing a laminate substrate; characterizing the laminate substrate for warpage characteristics; determining a horizontal plane distortion based on the warpage characteristics; placing the laminate substrate into a fixture with an adjustment to correct the horizontal plane distortion, the adjustment being located in a center of the laminate substrate, wherein the adjustment contacts the laminate substrate; fluxing the laminate substrate; placing a chip onto the laminate substrate; and placing the fixture into a reflow furnace to join the chip and the laminate substrate. |
| 地址 |
Armonk NY US |
