SUBSTRATE HOLDER, POLISHING APPARATUS, POLISHING METHOD, AND RETAINING RING

摘要

The object of the present invention is to provide a substrate holding and supporting apparatus capable of preventing the rise of a polishing rate on the edge of a substrate even though a plurality of substrates are continuously polished. The substrate holding and supporting apparatus (1) includes a top ring body (10) which holds and supports a substrate (W) and a retainer ring (40) which is arranged to surround the substrate which is held and supported on the top ring body (10). The retainer ring (40) includes an annular pad pressing part (122) in contact with a polishing pad (2). The pad pressing part (122) has a width between 3mm and 7.5mm.