| 摘要 |
<p>The present invention comprises a wafer stage module (10), an ejection module (20), a flipper module (30) and a pickup module (40), wherein the wafer stage module (10) is driven in X, Y and Z directions, the ejection module (20) is driven in the Z direction and a T direction, and a pickup head (41) of the pickup module (40) is driven in the X, Y, Z and T directions so as to perform a misalignment, that is, a T-directional alignment, between a chip ejected from a wafer and a needle unit of an ejector before picking up the chip and to transfer the chip to a head pressing tool at an exact position after performing the final alignment by moving the pickup head in the X, Y and T directions with respect to the center of a chip transfer after picking up the chip.</p> |
