| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for facilitating maintenance of an electrolyte and enabling uniform plating reduced in defects, in a damascene treatment or a dual damascene treatment in production of a semiconductor element.SOLUTION: An electroplating cell includes an upper chamber formed partially by a circular wall, or a cathode chamber 715. The upper cathode liquid chamber 715 and a lower anode chamber 717 of the cell are separated by a film 740 and a reverse-conical support structure 738. The flow line 748 shows a passage which rises and passes a voluntary flow formation plate 702. The anode chamber 717 includes an anode 742 and a charge plate 743 for supplying power to the anode 742. The anode also includes an inlet branched tube 747 supplying an anode liquid to the surface of the anode by immersing the upper surface of the anode 742 and a series of lateral grooves 746. A cathode liquid inlet 744 is connected to the anode 742 and the center of the anode chamber 717. |
