| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component package capable of improving precision in aligning an encapsulation resin sheet and an adherend.SOLUTION: The manufacturing method of the electronic component package includes: a step A of preparing an adherend in which one or more electronic components are packaged and of which the planar view is polygonal; a step B of preparing an encapsulation resin sheet of which the planar view shape is the substantially same polygon as the adherend; a step C of recognizing xy coordinates of at least two apexes on the polygon of the adherend and xy coordinates of at least two apexes on the polygon of the encapsulation resin sheet corresponding to the at least two apexes, respectively, in a planar view; and a step D of matching overlap positions of the adherend and the encapsulation resin sheets in such a manner that the recognized xy coordinates of the mutually corresponding apexes in the adherend and the encapsulation resin sheet are proximate at a maximum in the planar view.</p> |
