ELECTRONIC DEVICE

摘要

In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball side is limited. The electronic device includes an interconnect layer (a first interconnect layer) and an interconnect layer (a second interconnect layer). The second interconnect layer is formed on the undersurface of the first interconnect layer. The second interconnect layer is larger in area seen from the top than the first interconnect layer and is extended to the outside from the first interconnect layer.

主权项

1. A semiconductor device comprising:
a first wiring substrate having a first surface and a second surface opposite the first surface, the first wiring substrate including a plurality of first wirings; a second wiring substrate as an interposer having a first main surface and a second main surface opposite the first main surface, a plurality of second wirings formed on the first main surface, the second wiring substrate disposed on the first surface of the first wiring substrate; a first semiconductor chip having a first obverse surface, a plurality of first electrodes formed on the first obverse surface, the first semiconductor chip mounted on the first main surface of the second wiring substrate; and a second semiconductor chip having a second obverse surface, a plurality of second electrodes formed on the second obverse surface, the second semiconductor chip mounted side by side with the first semiconductor chip on the first main surface of the second wiring substrate, wherein the first semiconductor chip is electrically connected with the second semiconductor chip via the second wirings of the second wiring substrate, and wherein the first wirings of the first wiring substrate are electrically connected with the second wirings of the second wiring substrate.