发明名称 |
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, IN-MILLIMETER-WAVE DIELECTRIC TRANSMISSION DEVICE, METHOD OF MANUFACTURING THE SAME, AND IN-MILLIMETER-WAVE DIELECTRIC TRANSMISSION SYSTEM |
摘要 |
A millimeter-wave dielectric transmission device. The millimeter-wave dielectric transmission device includes a semiconductor chip provided on one interposer substrate and capable of millimeter-wave dielectric transmission, an antenna structure connected to the semiconductor chip, two semiconductor packages including a molded resin configured to cover the semiconductor chip and the antenna structure, and a dielectric transmission path provided between the two semiconductor packages to transmit a millimeter wave signal. The semiconductor packages are mounted such that the antenna structures thereof are arranged with the dielectric transmission path interposed therebetween. |
申请公布号 |
US2015137336(A1) |
申请公布日期 |
2015.05.21 |
申请号 |
US201514609658 |
申请日期 |
2015.01.30 |
申请人 |
Sony Corporation |
发明人 |
Kawamura Hirofumi;Okada Yasuhiro |
分类号 |
H01Q21/00;H01L23/66;H01Q9/04 |
主分类号 |
H01Q21/00 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor device comprising:
a semiconductor chip on a substrate and capable of millimeter-wave band communication; a coupler structure connected to the semiconductor chip; and a millimeter wave transmission member made of a dielectric material including a dielectric capable of millimeter wave signal transmission and matched with the coupler structure. |
地址 |
Tokyo JP |