发明名称 SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, IN-MILLIMETER-WAVE DIELECTRIC TRANSMISSION DEVICE, METHOD OF MANUFACTURING THE SAME, AND IN-MILLIMETER-WAVE DIELECTRIC TRANSMISSION SYSTEM
摘要 A millimeter-wave dielectric transmission device. The millimeter-wave dielectric transmission device includes a semiconductor chip provided on one interposer substrate and capable of millimeter-wave dielectric transmission, an antenna structure connected to the semiconductor chip, two semiconductor packages including a molded resin configured to cover the semiconductor chip and the antenna structure, and a dielectric transmission path provided between the two semiconductor packages to transmit a millimeter wave signal. The semiconductor packages are mounted such that the antenna structures thereof are arranged with the dielectric transmission path interposed therebetween.
申请公布号 US2015137336(A1) 申请公布日期 2015.05.21
申请号 US201514609658 申请日期 2015.01.30
申请人 Sony Corporation 发明人 Kawamura Hirofumi;Okada Yasuhiro
分类号 H01Q21/00;H01L23/66;H01Q9/04 主分类号 H01Q21/00
代理机构 代理人
主权项 1. A semiconductor device comprising: a semiconductor chip on a substrate and capable of millimeter-wave band communication; a coupler structure connected to the semiconductor chip; and a millimeter wave transmission member made of a dielectric material including a dielectric capable of millimeter wave signal transmission and matched with the coupler structure.
地址 Tokyo JP