Coil Arrangement with Metal Filling

摘要

Devices, methods and production devices that relate to the forming of a coil on a semiconductor substrate are provided. Arranged within the coil is a metal filling, for example with a density of less than 20%.

主权项

1. A device, comprising:
a semiconductor substrate, a coil formed on the semiconductor substrate, and a metal filling within the coil, the coil being a radio-frequency coil of at least one of a radio-frequency transmitting, receiving or transceiver device.