METHOD AND APPARATUS FOR ELECTROPLATING

摘要

The present invention relates to an electroplating method to manufacture a printed circuit substrate. Provided is the electroplating method which allows carrier fixed by interlocking the printed circuit substrate panel with a clamp to descend, performs electroplating by immersing the panel into an electroplating bath in which an electroplating solution is filled, moves the carrier from side to side to oscillate, and applies vibration to the panel fixed on the carrier using an electric motor installed on the carrier.