| 发明名称 |
PATTERNED PHOTORESIST TO ATTACH A CARRIER WAFER TO A SILICON DEVICE WAFER |
| 摘要 |
Patterned photoresist is used to attach a carrier wafer to a silicon device wafer. In one example, a silicon wafer is patterned for contact bumps by applying a photoresist over a surface of the wafer and removing the photoresist in locations at which the contact bumps are to be formed. The contact bumps are formed in the locations at which the photoresist is removed. A temporary carrier is attached to the photoresist over the wafer. The back side of the wafer opposite the contact bumps is processed while handling the wafer using the temporary carrier. The temporary carrier is removed. The photoresist on the front side of the wafer with the contact bumps is removed after removing the temporary carrier. |
| 申请公布号 |
US2015140801(A1) |
申请公布日期 |
2015.05.21 |
| 申请号 |
US201314083352 |
申请日期 |
2013.11.18 |
| 申请人 |
Toh Chin Hock;Kitowski Aksel;Mahajan Uday;Tan Thean Ming |
发明人 |
Toh Chin Hock;Kitowski Aksel;Mahajan Uday;Tan Thean Ming |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method comprising:
patterning a silicon wafer for a plurality of contact bumps by applying a photoresist over a surface of the wafer and removing the photoresist in locations at which the contact bumps are to be formed; forming the contact bumps in the locations at which the photoresist is removed; attaching a temporary carrier to the photoresist over the wafer; processing the back side of the wafer opposite the contact bumps while handling the wafer using the temporary carrier; removing the temporary carrier; and removing the photoresist on the front side of the wafer with the contact bumps after removing the temporary carrier. |
| 地址 |
Singapore SG |
