CIRCUIT CONNECTING MATERIAL AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING SAME

摘要

Provided are a circuit connecting material able to provide good bonding with an opposing electrode, and a semiconductor device manufacturing method using the same. The present invention uses a circuit connecting material, in which a first adhesive layer to be adhered to the semiconductor chip side, and a second adhesive layer having a lowest melting viscosity attainment temperature higher than that of the first adhesive layer are laminated. When the semiconductor chip on which the circuit connecting material is stuck is mounted on a circuit board, a thickness of the first adhesive layer is within a range satisfying formula (1), thereby providing good bonding with the opposing electrode.

主权项

1. A circuit connecting material for bonding a semiconductor chip in which a solder-adhered electrode is formed and a circuit board on which an opposing electrode opposite to the solder-adhered electrode is formed,
wherein a first adhesive layer to be adhered to the semiconductor chip side, and a second adhesive layer having a lowest melting viscosity attainment temperature higher than that of the first adhesive layer are laminated, and when the semiconductor chip on which the circuit connecting material is stuck is mounted on the circuit board, at a temperature lower than the lowest melting viscosity attainment temperature of the first adhesive layer, a thickness Hb1 of the first adhesive layer is within a range satisfying the following formula (1):
0.5×He1≦Hb1≦He1+0.75×Hs  formula (1) where He1 denotes an electrode thickness of the solder-adhered electrode, and Hs denotes a solder thickness of the solder-adhered electrode.