发明名称 |
ACOUSTIC DEVICE AND MICROPHONE PACKAGE INCLUDING THE SAME |
摘要 |
There are provided an acoustic device manufactured using a micro electro mechanical system (MEMS) technology, and a microphone package including the acoustic device. The acoustic device includes a device substrate including a cavity formed therein, a diaphragm formed to cover the cavity on the device substrate, a back plate formed to be spaced apart from the diaphragm, and a shielding plate disposed to be spaced apart from the diaphragm and the back plate, including a plurality of through holes, and shielding noise introduced from outside. |
申请公布号 |
US2015139467(A1) |
申请公布日期 |
2015.05.21 |
申请号 |
US201414268597 |
申请日期 |
2014.05.02 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
PARK Heung Woo |
分类号 |
H04R1/04 |
主分类号 |
H04R1/04 |
代理机构 |
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代理人 |
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主权项 |
1. An acoustic device comprising:
a device substrate including a cavity formed therein; a diaphragm formed to cover the cavity on the device substrate; a back plate formed to be spaced apart from the diaphragm; and a shielding plate disposed to be spaced apart from the diaphragm and the back plate, including a plurality of through holes therein, and blocking noise introduced from outside. |
地址 |
Suwon-Si KR |