发明名称 ACOUSTIC DEVICE AND MICROPHONE PACKAGE INCLUDING THE SAME
摘要 There are provided an acoustic device manufactured using a micro electro mechanical system (MEMS) technology, and a microphone package including the acoustic device. The acoustic device includes a device substrate including a cavity formed therein, a diaphragm formed to cover the cavity on the device substrate, a back plate formed to be spaced apart from the diaphragm, and a shielding plate disposed to be spaced apart from the diaphragm and the back plate, including a plurality of through holes, and shielding noise introduced from outside.
申请公布号 US2015139467(A1) 申请公布日期 2015.05.21
申请号 US201414268597 申请日期 2014.05.02
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 PARK Heung Woo
分类号 H04R1/04 主分类号 H04R1/04
代理机构 代理人
主权项 1. An acoustic device comprising: a device substrate including a cavity formed therein; a diaphragm formed to cover the cavity on the device substrate; a back plate formed to be spaced apart from the diaphragm; and a shielding plate disposed to be spaced apart from the diaphragm and the back plate, including a plurality of through holes therein, and blocking noise introduced from outside.
地址 Suwon-Si KR