APPARATUS AND METHOD FOR SELECTIVELY INSPECTING COMPONENT SIDEWALLS

摘要

A component inspection process includes positioning a component (e.g., a semiconductor component or other object) such that component sidewalls are disposed along an optical path corresponding to sidewall beam splitters configured for receiving sidewall illumination provided by a set of sidewall illuminators, and transmitting this sidewall illumination therethrough, toward and to component sidewalls. Sidewall illumination incident upon component sidewalls is reflected from the component sidewalls back toward the sidewall beam splitters, which reflect or redirect this reflected sidewall illumination along an optical path corresponding to an image capture device for sidewall image capture to enable component sidewall inspection. Sidewall illuminators and sidewall beam splitters can form portions of a five sided inspection apparatus that includes a brightfield illuminator, a darkfield illuminator, and an image capture beam splitter such that the five sided inspection apparatus is configurable for inspecting component bottom surfaces and/or component sidewalls in a selective/selectable manner.

主权项

1. An apparatus configured for inspecting component surfaces including component sidewalls, the apparatus comprising:
a set of sidewall illuminators configured to output sidewall illumination; a set of sidewall beam splitters configured for:
(a) receiving sidewall illumination output by the set of sidewall illuminators;(b) transmitting said sidewall illumination output by the set of sidewall illuminators through the set of sidewall beam splitters, such that at least some the sidewall illumination is incident on component sidewalls when a component is positioned within a sidewall inspection area at a sidewall inspection position at which the component sidewalls obstruct at least some optical paths between individual sidewall beam splitters within the set of sidewall beam splitters;(c) receiving reflected sidewall illumination from component sidewalls when the component is positioned at the sidewall inspection position; and(d) redirecting the reflected sidewall illumination along optical paths corresponding to a lens assembly and an image capture device.