发明名称 INTEGRATED CIRCUIT ARRAY AND METHOD FOR MANUFACTURING AN ARRAY OF INTEGRATED CIRCUITS
摘要 An integrated circuit array, in particular for two dimensional sensor arrays such as ultrasound imaging systems is disclosed. The integrated circuit array (10) comprises a plurality of integrated circuit elements (12) each formed in a substrate (14), wherein the substrates are separated from each other. The array comprises a flexible and / or stretchable connection layer (22) connected to the integrated circuit elements for flexibly connecting the integrated circuit elements to each other. The array further comprises a plurality of electrical interconnects (18) for electrically connecting the integrated circuit elements to each other, wherein the electrical interconnects are formed as metal lines in one piece with integrated interconnects of the integrated circuit elements.
申请公布号 WO2015071051(A1) 申请公布日期 2015.05.21
申请号 WO2014EP72260 申请日期 2014.10.16
申请人 KONINKLIJKE PHILIPS N.V.;STICHTING MATERIALS INNOVATION INSTITUTE (M2I) 发明人 DEKKER, RONALD;HENNEKEN, VINCENT ADRIANUS;SAVOV, ANGEL METODIEV
分类号 H01L23/00;A61B8/00;A61N1/05;H01L23/498;H01L23/538;H01L27/146 主分类号 H01L23/00
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