发明名称 DETERMINATION OF ELECTROMIGRATION SUSCEPTIBILITY BASED ON HYDROSTATIC STRESS ANALYSIS
摘要 Aspects of the invention relate to techniques for determining the electromigration features corresponding to layout design data. According to various examples of the invention, a circuit design is analyzed to determine voltages of nodes in an interconnect tree. From the voltages of the nodes, current density values and current directions for the segments of the interconnect tree are determined. Based on the current density values and the current directions, hydrostatic stress values for the nodes are computed under a steady-state condition and conservation of the conductive material within the interconnect tree. The electromigration susceptibility of the interconnect tree is then determined based on the computed hydrostatic stress values.
申请公布号 US2015143318(A1) 申请公布日期 2015.05.21
申请号 US201314090294 申请日期 2013.11.26
申请人 Mentor Graphics Corporation 发明人 Gibson Patrick;Sukharev Valeriy;Hogan William Matthew;Srinivasan Sridhar
分类号 G06F17/50 主分类号 G06F17/50
代理机构 代理人
主权项 1. One or more processor-readable storage device storing computer-executable instructions for causing one or more processors to perform a method, the method comprising: analyzing a circuit design to determine voltages of nodes in an interconnect tree, the interconnect tree comprising continuously connected geometric elements of a conductive material confined by diffusion blocking ends to one layer of a layout design for the circuit design, the nodes comprising locations where electron flows change directions, diverge, converge or reach diffusion blocking ends such as vias, the circuit design containing parasitic resistance information for the interconnect tree; determining, based on the voltages of the nodes, current density values and current directions for segments of the interconnect tree, each of the segments being a part of the interconnect tree confined by a pair of neighboring nodes in the nodes; computing, based on the current density values and the current directions, hydrostatic stress values for the nodes under a state that assumes a steady-state condition, no voids being nucleated and conservation of the conductive material within the interconnect tree, the steady-state condition being a condition of no atomic fluxes in the interconnect tree; and determining electromigration susceptibility of the interconnect tree based on the hydrostatic stress values.
地址 Wilsonville OR US