发明名称 PHOTOCURABLE RESIN COMPOSITION AND PHOTOCURABLE RESIN COMPOSITION-MADE SHEET OBTAINED BY USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a photocurable resin composition excellent all in transparency, heat resistance, flexibility, follow up ability to unevenness and releasability without generating bleedout.SOLUTION: There is provided the photocurable resin composition which contains following components (A) to (D), the amount of the component (A) being set in a range of 30 to 70 pts.wt., the amount of the component (B) being set in a range of 10 to 40 pts.wt., the amount of the component (C) being set in a range of 10 to 30 pts.wt. and the amount of the component (D) being set to be 0.5 to 2.0 pts.wt based on 100 pts.wt. of the total amount of the components (A), (B) and (C). (A) a solid epoxy resin having an epoxy equivalent of 7000 to 13000 g/eq. (B) a solid epoxy resin having an epoxy equivalent of 400 to 1000 g/eq. (C) a liquid epoxy resin having a viscosity at 25°C of 12 to 25 Pa s. (D) an optical acid generator.
申请公布号 JP2015096571(A) 申请公布日期 2015.05.21
申请号 JP20130237032 申请日期 2013.11.15
申请人 NITTO DENKO CORP 发明人 HIGO YUKIKO
分类号 C08G59/40 主分类号 C08G59/40
代理机构 代理人
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