CAMERA MODULE

摘要

One or more embodiments are directed to optical module assemblies, such as a camera module assembly, and methods of forming same. One embodiment is directed to an optical module assembly that includes a substrate having a first surface. An optical device is secured to the first surface of the substrate and electrically coupled to the substrate. A molded body is located on the first surface of the substrate outward of the optical device. The molded body includes a first recess. A lens assembly is secured to the molded body over the first recess by an adhesive material located in the first recess. In some embodiments, the molded body of the optical module assembly further includes a second recess spaced apart from the first recess. A transparent material is secured to the molded body over the second recess by an adhesive material located in the second recess.

主权项

1. A camera module assembly comprising:
a substrate having a first surface and a pad formed on the first surface; an optical device secured to the first surface of the substrate, the optical device having a pad; a conductive wire having a first end coupled to the pad of the substrate and a second end coupled to the pad of the optical device; a molded body on the first surface of the substrate outward of the optical device, a first surface of the molded body including a first recess; an adhesive material in the first recess; and a lens assembly secured to the first surface of the molded body over the first recess by the adhesive material.