METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

摘要

The embodiment of the present invention relates to a method for manufacturing a semiconductor chip, the semiconductor chip, and a semiconductor device. The method for manufacturing the semiconductor chip according to the embodiment of the present invention includes the steps of determining a plurality of first regions protected by a plurality of etching masks and a second region which is an exposure region on a semiconductor substrate by forming the etching masks with protection layers on the semiconductor substrate; and reforming the semiconductor substrate into a plurality of chip bodies corresponding to the first regions by forming a plurality of grooves with the lower sides which reach the rear side of the semiconductor substrate and a sidewall which is partially located on the same surface as the end surface of the etching mask by anisotropically the second region by a chemical etching process.