ELECTRO/MECHANICAL MICROCHIPS AND METHOD OF MAKING WITH BURST ULTRAFAST LASER PULSES

摘要

A method for making an electromechanical chip using a plurality of transparent substrates, comprising the steps of: machining, using photoacoustic compression, full or partial voids in at least one of the plurality of substrates. The plurality of transparent substrates are stacked and arranged in a specific order. The transparent substrates are affixed and sealed together. The chip may be sealed by laser welding or adhesive.

主权项

1. A method for making an electromechanical chip using a first transparent substrate and a second transparent substrate, comprising the steps of:
machining full or partial voids on said first transparent substrate using photoacoustic compression; and, affixing said first transparent substrate and said second transparent substrate together.