发明名称 LIGHT SOURCE UNIT AND BACKLIGHT ASSEMBLY HAVING THE SAME
摘要 A method of protecting an LED chip from damage by ESD and EMI when the LED chip is housed in a light-emitting diode(s) housing package (LED package) and the LED package is mounted on a printed circuit board is provided. The method comprises a step of not including an ESD and EMI suppressing Zener diode within the combination of the printed circuit board and the LED package and of providing within the combination of the printed circuit board and the LED package a first conductive member and a spaced apart second conductive member which are electrically connected to the LED chip and which have defined between them at least one insulative ESD and/or EMI suppressing region which breaks down in its insulative properties when subjected to voltages of absolute magnitudes greater than a predetermined threshold voltage.
申请公布号 US2015138827(A1) 申请公布日期 2015.05.21
申请号 US201414262438 申请日期 2014.04.25
申请人 Samsung Display Co., Ltd. 发明人 SONG Si Joon;KIM Hyuk Hwan;NAM Seok Hyun;YE Byoung Dae;LEE Young Keun
分类号 H01L23/60;F21V8/00;H01L25/16;G02F1/1335;H01L33/62;H01L23/552 主分类号 H01L23/60
代理机构 代理人
主权项 1. A light source unit comprising: a light-emitting diode(s) housing package (LED package) which houses at least one LED chip; and a printed circuit board on which the LED package is mounted, wherein the printed circuit board comprises a first conductive member and a spaced apart second conductive member which are electrically connected to the LED chip wherein the first conductive member is located on a side of the LED package, the second conductive member is located on the other side of the LED package which is opposite the side of the LED package, and the first conductive member comprises a first protrusion which protrudes toward the second conductive member.
地址 Yongin-City KR