IMAGE SENSOR PACKAGE STRUCTURE AND METHOD

摘要

Image sensor package structure and method are provided. The method includes: providing first substrate having upper surface on which image sensing areas and pads are formed; providing second substrate having through holes; forming tape film on upper surface of second substrate to seal each through hole; contacting lower surface of second substrate with upper surface of first substrate to make image sensing areas in through holes; removing portions of tape film and second substrate, wherein remained tape film and second substrate form cavities including sidewalls made of second substrate and caps sealing sidewalls and made of tape film, and remained second substrate also covers pads; removing portions of remained second substrate to expose pads; slicing first substrate to form single image sensor chips including image sensing areas and pads; and electrically connecting pads with circuits on third substrate through wires. Pollution or damage to image sensing areas may be avoided.

主权项

1. An image sensor package method, comprising:
providing a first substrate, wherein the first substrate has an upper surface on which a plurality of image sensing areas and a plurality of pads are formed; providing a second substrate which has a plurality of through holes formed therein; forming a tape film on an upper surface of the second substrate to seal one end of each of the plurality of through holes; contacting a lower surface of the second substrate with the upper surface of the first substrate to make the plurality of image sensing areas disposed in the plurality of through holes and the plurality of pads disposed outside the through holes; removing portions of the tape film and portions of the second substrate by cutting, wherein the remained tape film and the remained second substrate form cavities each of which comprises a sidewall made of a portion of the second substrate and a cap which seals the sidewall from the top and is made of a portion of the tape film, and the remained second substrate also covers the plurality of pads; removing portions of the remained second substrate to expose the plurality of pads; slicing the first substrate to form a plurality of single image sensor chips each of which comprises at least one of the image sensing areas and at least one of the pads; and electrically connecting the at least one pad on one of the plurality of single image sensor chips with a circuit on a third substrate through wires.