PIEZOELECTRIC WAFER, PIEZOELECTRIC VIBRATION PIECE, AND PIEZOELECTRIC VIBRATOR

摘要

This piezoelectric wafer has: a piezoelectric vibration piece; a frame section that supports the piezoelectric vibration piece; and a connecting section that connects the frame section and the piezoelectric vibration piece to each other. At the connecting section in the piezoelectric wafer, a crystal vibration piece is broken and taken from the frame section. In both the front and rear surfaces of the connecting section, groove-like slits that extend in the width direction of the connecting section are formed, respectively, excluding a connecting section part in the width direction of the connecting section. An electrode on the front and/or rear surface of the piezoelectric vibration piece is led out to the frame section side via the connecting section part in the width direction of the connecting section.