发明名称 |
CIRCUIT BOARD AND SEMICONDUCTOR COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board which balances downsizing and inhibition of malfunction caused by element mutual interference, noise and the like.SOLUTION: A circuit board of an embodiment is a circuit board in which a plurality of electronic components are mounted on a printed circuit board and which comprises: a semiconductor device mounted on the printed circuit board; and a first EBG structure provided on the printed circuit board on the side opposite to the semiconductor device, in which an operation frequency of the semiconductor device is outside a cut-off band of the first EBG structure. The first EBG structure has a mushroom structure which includes: an electrode part formed by a first conductor; a batch part which is provided almost parallel with the electrode part and formed by a second conductor and equal to or less than 10 mm square; an insulation layer provided between the electrode part and the batch part; and a via which is provided in the insulation layer between the batch part and the electrode part and connected to the batch part and the electrode part. |
申请公布号 |
JP2015097273(A) |
申请公布日期 |
2015.05.21 |
申请号 |
JP20140252363 |
申请日期 |
2014.12.12 |
申请人 |
TOSHIBA CORP |
发明人 |
SASAKI TADAHIRO;ITAYA KAZUHIKO;YAMADA HIROSHI |
分类号 |
H01L23/12;H01L23/00;H05K3/46 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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