METHOD AND APPARATUS FOR FORWARD DEPOSITION OF MATERIAL ONTO A SUBSTRATE USING BURST ULTRAFAST LASER PULSE ENERGY

摘要

A process of forward deposition of a material onto a target substrate is accomplished by passing a burst of ultrafast laser pulses of a laser beam through a carrier substrate that is transparent to a laser beam. The carrier substrate is coated with a material to be transferred on the bottom side thereof. Electrons on the back side of said transparent carrier coated with the material are excited by the first few sub-pulses of the laser beam which lifts the material from the carrier substrate and subsequent sub-pulse of the laser beam send the material into space at hypersonic speed by a shock wave that drives the material with forward momentum across a narrow gap between the carrier substrate and the target substrate, and onto the target substrate.

主权项

1. A process of forward deposition of a material onto a target substrate, comprising the steps of:
producing a burst of ultrafast laser pulses of a laser beam, said burst of ultrafast laser pulses includes a burst pulse envelope having sub-pulses; focusing said laser beam below the diffraction limit of said laser beam; passing said focused burst of ultrafast laser pulses of said laser beam through a carrier material transparent to said laser beam, said carrier substrate includes a bottom surface previously coated with said material to be transferred; exciting electrons on the bottom side of said transparent carrier coated with said material with said the first few sub-pulses of said burst of pulses of said laser beam; lifting said material from said carrier substrate; continuing to pass subsequent sub-pulses of said burst of pulses of said laser beam through said carrier substrate which do not encounter any material to lift and now pass through said carrier substrate with a very high divergence angle; sending said now-lifted material into space at hypersonic speed by a shock wave that drives said material with forward momentum across a narrow gap between said carrier substrate and said target substrate, and onto said target substrate; and, fusing said material onto and into said target substrate.