发明名称 Chip Substrate Having a Lens Insert
摘要 A chip substrate includes: a conductive layer being stacked in one direction and constituting a chip substrate; an insulator being alternately stacked with the conductive layer and electrically separating the conductive layer; and a lens insert having: a depression reaching down to a predetermined depth from a specified area of an upper surface of the chip substrate overlapping with the insulator; and a predetermined number of sides on the upper surface wherein arcs are formed at regions where the sides are met with each other. Since the space for inserting a lens can be formed to have a shape comprising straight lines, and a lens to be inserted can also be manufactured in a shape comprising straight lines, therefore the manufacturing process for a lens to be inserted into the chip substrate can be further simplified.
申请公布号 US2015138656(A1) 申请公布日期 2015.05.21
申请号 US201414546201 申请日期 2014.11.18
申请人 Point Engineering Co., Ltd. 发明人 Ahn Bum Mo;Nam Ki Myung;Jun Young Chul
分类号 H05K1/02;G02B7/02 主分类号 H05K1/02
代理机构 代理人
主权项 1. A chip substrate comprising: a conductive layer being stacked in one direction and constituting a chip substrate; an insulator being alternately stacked with the conductive layer and electrically separating the conductive layer; and a lens insert having: a depression reaching down to a predetermined depth from a specified area of an upper surface of the chip substrate overlapping with the insulator; and a predetermined number of sides on the upper surface wherein arcs are formed at regions where the sides are met with each other.
地址 Asan-si KR