发明名称 |
Chip Substrate Having a Lens Insert |
摘要 |
A chip substrate includes: a conductive layer being stacked in one direction and constituting a chip substrate; an insulator being alternately stacked with the conductive layer and electrically separating the conductive layer; and a lens insert having: a depression reaching down to a predetermined depth from a specified area of an upper surface of the chip substrate overlapping with the insulator; and a predetermined number of sides on the upper surface wherein arcs are formed at regions where the sides are met with each other. Since the space for inserting a lens can be formed to have a shape comprising straight lines, and a lens to be inserted can also be manufactured in a shape comprising straight lines, therefore the manufacturing process for a lens to be inserted into the chip substrate can be further simplified. |
申请公布号 |
US2015138656(A1) |
申请公布日期 |
2015.05.21 |
申请号 |
US201414546201 |
申请日期 |
2014.11.18 |
申请人 |
Point Engineering Co., Ltd. |
发明人 |
Ahn Bum Mo;Nam Ki Myung;Jun Young Chul |
分类号 |
H05K1/02;G02B7/02 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
1. A chip substrate comprising:
a conductive layer being stacked in one direction and constituting a chip substrate; an insulator being alternately stacked with the conductive layer and electrically separating the conductive layer; and a lens insert having: a depression reaching down to a predetermined depth from a specified area of an upper surface of the chip substrate overlapping with the insulator; and a predetermined number of sides on the upper surface wherein arcs are formed at regions where the sides are met with each other. |
地址 |
Asan-si KR |