| 摘要 |
The present invention relates to a laser optic device for bonding a flip chip by laser pressing, which can supply a uniform heat source over a wide area by irradiating a square beam, of which the uniformity is constantly maintained, to a semiconductor chip when the flip chip is bonded by using laser pressing. According to the present invention, the laser optic device, which can allow the semiconductor chip to be bonded on a circuit board by irradiating a laser beam to a bonding head provided at the lower part of a bonding head module to suck the semiconductor chip by means of vacuum suction force and press the semiconductor chip by bringing the semiconductor chip into close contact with the circuit board, comprises: a barrel (410) provided at the side of the upper part of the bonding head (550) so as to convert the laser beam generated from an external laser head (300) and transmitted through optical fibers into a square laser beam through a plurality of lenses and output the square laser beam in a horizontal direction; and a reflecting mirror (430) provided at the upper part of the bonding head (550) so as to change the horizontal laser beam outputted from the barrel (410) into the laser beam in a vertical downward direction and transmit, as a heat source, the laser beam to the semiconductor chip vacuum-sucked to the lower part of the bonding head by irradiating the vertical downward laser beam to the bonding head (550), and is provided so as to supply a square laser heat source, of which the uniformity is constantly maintained, to the semiconductor chip and to easily and precisely adjust the size of the laser beam according to the size of the semiconductor chip. |
