APPARATUS FOR ASSESSMENT OF VOIDS IN SOLDER AND METHOD FOR ASSESSMENT OF VOIDS IN SOLDER

摘要

An apparatus for assessing voids in solder comprises: a function calculation unit that processes the pixels constituting an image of the interior of a piece of solder such that the pixels in the voids have a pixel value pi of 1 and the pixels not in the voids have a pixel value pi of 0 and uses a weighting function w (ri) for the distance ri from the center of the piece of solder, the maximum of the function being at the center of the piece of solder (ri = 0) and the minimum being at the maximum radius (ri = r0), to calculate the following void assessment function, where i represents pixel number (1-N), pi represents pixel value (0 or 1), and w(ri) represents the weighting function; and a void assessment unit which performs assessment for each piece of solder in a manner such that the greater the relative size of the assessment function the greater the influence of the voids.