发明名称 MODULAR DEVICE FOR RAISING SEEDLING
摘要 The present invention discloses a modular device for raising seedling that comprises at least two individual containers to receive a culture medium and a seedling, and at least a coupling member. Each of the individual containers is provided with at least a pair of the coupling bumps arranged on two opposing positions respectively on both lateral edges of the individual container, and is protruded at a predetermined height from a backside of the individual container. Each of the coupling members is provided with a mating groove which is arranged in extending around its longitudinal shape so as to form a serial connection of the individual containers by means of mating the coupling bump with the mating groove within the same coupling member between two adjacent individual containers.
申请公布号 US2015135592(A1) 申请公布日期 2015.05.21
申请号 US201314084686 申请日期 2013.11.20
申请人 Lin Ming-Tsun 发明人 Lin Ming-Tsun;LIN CHIA-CHING;LEE MING-CHANG;HSIAO CHIEN-YI;CHOU JEN-LIANG;YANG CHENG-HUNG
分类号 A01G9/10 主分类号 A01G9/10
代理机构 代理人
主权项 1. A modular device for raising seedling, comprising: at least two individual containers, each of said individual containers having a first chamber recessed downwardly from a top side of said individual container so as to allow said first chamber to receive a culture medium and a seedling, said first chamber having a bottom provided with an outlet disposed thereon, said each individual container being provided with at least a pair of coupling bumps arranged on two opposing positions respectively on both lateral edges thereof and protruded at a predetermined height from a backside thereof; and at least a coupling member, formed in a longitudinal shape with a predetermined length, being provided with a mating groove arranged in extending around said longitudinal shape wherein said mating groove has a gap between its two inner longitudinal edges so as to allow said coupling bump to mate with, said mating groove having a distance between its two inner longitudinal edges thereof wherein the distance is greater than at least twice the width of said coupling bump.
地址 US