| 摘要 |
<p>Provided is a method for producing an electronic component package capable of improving the accuracy of position alignment between a sealing resin sheet and an adherend. The present invention pertains to a method for producing an electronic component package including: a step (A) for preparing an adherend which is polygonal in shape when seen from a planar view and to which one or more electronic components are mounted; a step (B) for preparing a sealing resin sheet, the shape of which when seen from a planar view is a polygon substantially identical to that of the adherend; a step (C) for recognizing, from a planar view, the x-y coordinates of two or more apexes of the polygonal adherend, and the x-y coordinates of two or more apexes of the polygonal sealing resin sheet which correspond to the two or more adherend apexes; and a step (D) for matching the overlap positions of the adherend and the sealing resin sheet in a manner such that the x-y coordinates of each of the mutually corresponding recognized apexes of the adherend and the sealing resin sheet are as close to one another as possible when seen from a planar view.</p> |
