| 摘要 |
PROBLEM TO BE SOLVED: To achieve a structure which is hard to be broken by an external force applied to a solder bump by achieving structural reinforcement of an opening periphery which abuts the solder bump even when a semiconductor process is increasingly miniaturized in a semiconductor integrated circuit where electrical connection with an electric circuit board of a connection destination is performed by the solder bump preliminarily attached to a chip.SOLUTION: A semiconductor integrated circuit 1 has a structure in which an insulation layer 18 arranged on a lower layer side comes in contact with another insulation layer 22 which composes a solder bump connection surface 25 on an inner side of an outer peripheral side periphery of the solder bump connection surface 25 and along a substrate surface direction of a semiconductor substrate 2, from the lower layer side along a substrate thickness direction of the semiconductor substrate 2. |
