ELECTRONIC COMPONENT, MANUFACTURING METHOD OF ELECTRONIC COMPONENT, AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide an electronic component that includes a highly reliable via connection structure.SOLUTION: A via connection structure 10 provided inside an insulating layer 20 includes a conductor layer 12 that has a surface 12c provided with a recess 12d, a barrier layer 13 that covers the surface 12c, and a via 14 that has an end 14a located inside the recess 12d covered by the barrier layer 13. This configuration achieves a highly reliable via connection structure 10 that increases the connection area of the via 14 and conductor layer 12 to increase adhesion strength and suppresses the occurrence of stress and electromigration in the vicinity of the barrier layer 13 to suppress an increase in resistance and the occurrence of disconnection; and an electronic component including the via connection structure 10.