Methods and Devices for Testing Segmented Electronic Assemblies

摘要

Methods and devices are disclosed for testing an electronic assembly comprising a number of segments. In one embodiment, a scalable periphery amplifier may comprise a number of amplifier segments. In one embodiment a method of testing the amplifier segments in a scalable periphery architecture is described. One or more of the amplifier segments can be independently turned on and/or turned off to achieve desired impedance characteristics of the overall amplifier to test the scalable periphery amplifier. In another embodiment, the electronic assembly comprises digitally tunable capacitors.

主权项

1. A method of testing a circuital arrangement, the method comprising:
a) providing an electronic assembly on a die, the electronic assembly comprising a plurality of electronic assembly segments, each electronic assembly segment having an input and an output, and the plurality of electronic assembly segments having an overall output impedance; b) connecting a testing device external to the die to the electronic assembly such that, when testing, a test signal is adapted to pass through the electronic assembly; c) configuring at least one of the electronic assembly segments in such a way as to be able to activate or deactivate the at least one of the electronic assembly segments; d) deactivating one or more electronic assembly segments of the plurality of electronic assembly segments, while leaving the remaining assembly segments activated, thus increasing the overall output impedance of the electronic assembly; and e) applying the test signal from the testing device to the electronic assembly, thus testing the one or more electronic assembly segments which are activated.