发明名称 部品実装方法および部品実装装置
摘要 <p>In a component mounting method and apparatus capable of mounting components on a board having a non-planar component mounting surface, a board holding table in a board holding device is turned based on board holding device information and board information to direct a normal line to a mounting portion on the non-planar component mounting surface in the vertical direction. Thus, after being picked up and moved by a component loading device onto the normal line to the mounting portion, a component can be mounted through a movement of the component loading device in the vertical direction only. Further, compensation amounts for the position of the mounting portion are calculated based on a turn amount, the board holding device information and the board information, and a compensated mounting position is calculated from the compensation amounts and the board information accurately in the horizontal and vertical directions.</p>
申请公布号 JP5721469(B2) 申请公布日期 2015.05.20
申请号 JP20110041207 申请日期 2011.02.28
申请人 发明人
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
代理机构 代理人
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