| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a mounting method and a mounting system of an electronic component which facilitate the improvement of the productivity and the simplification of the mounting system. <P>SOLUTION: A mounting method of an electronic component includes the steps of: (a) preparing the electronic component 200 where an electrode 204 including solder is formed on a surface; (b) placing a resin solid material 103 including a thermosetting resin at a portion on a substrate which overlaps with a peripheral part of the electronic component; (c) mounting the electronic component on the substrate with the electrode facing a connection terminal 102 so that the peripheral part of the electronic component is overlapped with the resin solid material; (d) heating the substrate or the like to a temperature higher than a melting point of the solder and a setting temperature of the resin solid material and then cooling the substrate, and thereby bonding the electronic component to the substrate with a hardened material of the thermosetting resin and joining the electrode to the connection terminal with the solder. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
