| 摘要 |
<P>PROBLEM TO BE SOLVED: To downsize a device and to simplify control. <P>SOLUTION: An alignment device 10 comprises supporting means 12 for supporting a semiconductor wafer W; guide means 16 positioned on the outer side of the semiconductor wafer W on the supporting means 12, and capable of regulating movement in a surface direction; floating means 14 for floating the semiconductor wafer W; displacement means 15 for relatively displacing the semiconductor wafer W and the supporting means 12; and detecting means 13 for detecting the position of a V-notch N of the semiconductor wafer W. The semiconductor wafer W supported by the supporting means 12 is floated, and then the semiconductor wafer W and the supporting means 12 are relatively displaced, thereby resolving the overlapping of the V-notch N and the supporting means 12 and the like. <P>COPYRIGHT: (C)2012,JPO&INPIT |
