BONDING APPARATUS

摘要

The present invention relates to a bonding apparatus. More specifically, the bonding apparatus according to the present invention forms an object to be bonded by laminating an anisotropic conductive adhesive between a first substrate and a second substrate, and bonds the object to be bonded with the anisotropic conductive adhesive. The bonding apparatus comprises: a base and a bonding tool on the base, wherein the bonding tool comprises: a main protruding part being in touch with the object to be bonded arranged between the bonding tool and the base, and hardening the anisotropic conductive adhesive; and a wing part formed at a different height from the main protruding part and hardening non-hardened anisotropic conductive adhesive. Therefore, the ratio of hardening is improved by the wing part of the bonding tool which provides thermal energy to harden the anisotropy conductive adhesive that is not hardened due to being flown out by welding force from the bonding tool, thus failure in bonding of the object to be bonded can be prevented.