发明名称 半導体装置、半導体装置の製造方法および基板処理装置
摘要 Provided is a semiconductor device including a metal film which can be formed with lower costs but still mange to have a necessary work function and oxidation resistance. The semiconductor device includes an insulating film disposed on a substrate; and a metal film disposed on the insulating film. The metal film includes a stacked structure of: a first metal film disposed on the insulating film to directly contact the insulating film; a second metal film disposed on the first metal film to directly contact the first metal film; and the first metal film disposed on the second metal film to directly contact the second metal film, the second metal film having a work function greater than 4.8 eV and being different from the first metal film in material, wherein an oxidation resistance of the first metal film is greater than that of the second metal film.
申请公布号 JP5721952(B2) 申请公布日期 2015.05.20
申请号 JP20100002256 申请日期 2010.01.07
申请人 株式会社日立国際電気 发明人 堀井 貞義;小川 有人;板谷 秀治
分类号 H01L29/423;C23C16/06;H01L21/28;H01L21/285;H01L21/336;H01L21/822;H01L21/8242;H01L27/04;H01L27/108;H01L29/49;H01L29/78 主分类号 H01L29/423
代理机构 代理人
主权项
地址