| 摘要 |
A system 20 includes an electronic device 22, a heat spreader 30 with a vapor chamber 44 attached to a bottom end of the electronic device 22, so that heat flows from the electronic device 22 to the heat spreader 30, and a heat sink 32 with microchannels 60 running through it attached to a bottom end of the heat spreader, so that heat from the heat spreader flows through the heat sink and to an ambient. A method for cooling a device includes transferring heat generated by a device through a conductivity layer 42, spreading the heat through a heat spreader 30, transferring the heat from the heat spreader to a heat sink 32 that contains microchannels 60, and releasing the heat from the heat sink 32 into an ambient. |
