半導体装置,申请号JP20130116064-传众专利搜索

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发明名称	半導体装置
摘要
申请公布号	JP5719407(B2)	申请公布日期	2015.05.20
申请号	JP20130116064	申请日期	2013.05.31
申请人		发明人
分类号	H01L27/04;H01L27/088;H01L29/47;H01L29/78;H01L29/872	主分类号	H01L27/04
代理机构		代理人
主权项
地址

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