| 摘要 |
A solid-state image pickup element IS1 is provided with a semiconductor substrate 1 having a photosensitive region 3, a plurality of first electrode pads 10 arrayed on a principal face 1 a of the semiconductor substrate 1, a plurality of second electrode pads 12 arrayed in a direction along a direction in which the plurality of first electrode pads 10 are arrayed, on the principal face 1a of the semiconductor substrate 1, and a plurality of interconnections 14 connecting the plurality of first electrode pads 10 and the plurality of second electrode pads 12 in one-to-one correspondence. The plurality of interconnections 14 connect the first and second electrode pads so that each interconnection connects the first electrode pad 10 and the second electrode pad 12 in a positional relation of line symmetry with respect to a center line 1 perpendicular to the array directions of the plurality of first and second electrode pads 10, 12. |
