SEMICONDUCTOR SECURED TO SUBSTRATE VIA HOLE IN SUBSTRATE
摘要
A device including a semiconductor and a substrate. The substrate has a first surface and a second surface that opposes the first surface. The substrate has a hole that extends from the first surface to the second surface and the semiconductor is secured to the substrate via adhesive in the hole.
申请公布号
EP2873095(A1)
申请公布日期
2015.05.20
申请号
EP20120880921
申请日期
2012.07.11
申请人
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
发明人
WU, JENNIFER;ZHANG, ZHUQING;DINGMAN, WALLACE ANDREW